Wafer Fabrication Process

A Fully Integrated Process Flow Across 100mm to 300mm Wafer

Overview

From development to high-volume production, Pure Wafer delivers advanced silicon wafer reclaim and fabrication services—maximizing wafer value while ensuring consistent performance at scale.

Process Flow

Each process step is tightly controlled using advanced metrology and process controls to ensure exceptional surface quality, uniformity, and repeatability.

End-to-End Reclaim & Fabrication Capabilities

Pure Wafer offers a fully integrated process flow across 100mm to 300mm wafers, with complete process ownership in U.S. facilities. Our capabilities include:

  • Step 01: Edge Grinding and Edge Polishing
  • Step 02: Lapping and grinding
  • Step 03: Strip and chemical etching
  • Step 04: DSP and front-side polishing
  • Step 05: Precision cleaning, drying and packaging

Engineered for Performance & Scale

By combining industry-leading reclaim technologies with precision fabrication, Pure Wafer delivers SEMI-standard and custom-engineered solutions that meet exact customer specifications. The result:

  • Lower costs
  • Extended wafer life
  • Reliable supply—supporting IDMs and OEMs from process development through full-scale manufacturing

Capabilities

Pure Wafer Fabrication Process Capabilities

End-to-end wafer reclaim and fabrication—engineered for precision, repeatability, and high-volume performance.

Capabilities

Pure Wafer Fabrication Process Capabilities

End-to-end wafer reclaim and fabrication—engineered for precision, repeatability, and high-volume performance.

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Precision Cleaning