A Fully Integrated Process Flow Across 100mm to 300mm Wafer
Overview
From development to high-volume production, Pure Wafer delivers advanced silicon wafer reclaim and fabrication services—maximizing wafer value while ensuring consistent performance at scale.
Process Flow
Each process step is tightly controlled using advanced metrology and process controls to ensure exceptional surface quality, uniformity, and repeatability.
End-to-End Reclaim & Fabrication Capabilities
Pure Wafer offers a fully integrated process flow across 100mm to 300mm wafers, with complete process ownership in U.S. facilities. Our capabilities include:
Step 01: Edge Grinding and Edge Polishing
Step 02: Lapping and grinding
Step 03: Strip and chemical etching
Step 04: DSP and front-side polishing
Step 05: Precision cleaning, drying and packaging
Engineered for Performance & Scale
By combining industry-leading reclaim technologies with precision fabrication, Pure Wafer delivers SEMI-standard and custom-engineered solutions that meet exact customer specifications. The result:
Lower costs
Extended wafer life
Reliable supply—supporting IDMs and OEMs from process development through full-scale manufacturing
Capabilities
Pure Wafer Fabrication Process Capabilities
End-to-end wafer reclaim and fabrication—engineered for precision, repeatability, and high-volume performance.
Capabilities
Pure Wafer Fabrication Process Capabilities
End-to-end wafer reclaim and fabrication—engineered for precision, repeatability, and high-volume performance.