Outsource your ASML “Zero” layer to Pure Wafer
- Start material with patterned and etched “zero” layers
- Etch depth SPC controlled to 1200A ±200A
- Pre-alignment & fine alignment characterization of all wafers, with batch statistics, available
Use Pure Wafer as your lithography cell backup and short term capacity add partner
- Lithography cell qualified to customer specifications
- Matched to customer WIP
- Regular lithography cell monitoring provides risk free switching
Calibrated wafer grid definition and target placement optimization
- Patterned, etched, alignment targets (for any system) placement to an accuracy of <15nm
- Alignment targets (for any system) on both sides of the wafer, with an overlay accuracy of <300nm (front to back)
Lens distortion and Focal Plane metrology
- Characterize and monitor your lens X,Y distortion
- Characterize and monitor your lens Focal Plane
Pure Wafer provides Pilot production runs: Lab to Fab
- Build your product using a foundry lithography system, it’s scalable, ready for production
- Outsource your critical layers to reduce your costs
Research and Development
- Explore your next technology node using Pure Wafer’s lithography cell
- Develop your first prototype devices
