| Process Steps | Process Flow | Process Details |
|---|---|---|
| 1 | RCA Clean | SC1 + SC2 @ 50C for 20' (each bath) |
| 2 | Rinse/SRD | DI H2O for 20'; Standard SRD |
| 3 | Visual Inspection | 100% Visual |
| Process Steps | Process Flow | Process Details |
|---|---|---|
| Single Wafer | LPC Clean | 80:2:1 DI Water 80 Parts |
| 1 | Hydrogen Peroxide 2 Parts | |
| 2 | Spin dry | Ammonia Hydroxide 1 Part |
| Inspect Wafer |
Above process for Non-Patterned Wafers.
Patterned wafers require a technical review of the feature size, films prior to accepting material.
