Precision Cleaning

Precision Surface Cleaning (PSC™)

Enables Quantum Sensing Reliability

Pure wafer cleans the final critical parts for the largest semiconductor OEMs and IDMs in the world. These parts are used by manufacturers to support 10 nm to 3 nm technology nodes.

Atomic-level clean: Silicon, Glass, Ceramics, and Quartz materials
Integrates precision cleaning, surface prep, and ICPMS verification
Controls total contamination: particles, inorganic, and organic residues
Sub-10nm cleanroom, handling, and environmental controls
Scientifically engineered for advanced materials and plasma environments
Moves parts cleaning from standalone service to process-integrated capability

Innovative new Precision Surface Cleaning (PSC™) — is the hidden enabler for quantum coherence, AI yield, and next-generation sensor reliability. Today Pure Wafer’s cleaning group:

Device scaling beyond 10nm sharply increasing contamination sensitivity
3D architectures (FinFET, GAA) introduce new materials and surfaces
Atomic-scale particles and trace metals now impact yield and reliability
Legacy parts cleaning and validation methods are insufficient
Quantum decoherence driven by surface contamination at the device layer
Higher defectivity, lower tool uptime, longer cycle times, higher CoO

For More Info on Pure Wafer’s Proprietary Precision Surface Cleaning Technology