Wafer reclaim enables manufacturers to reuse silicon substrates, reducing dependence on costly prime wafers while maintaining process efficiency and equipment performance. It’s a proven, cost-effective strategy used across the industry.
As the largest wafer reclaim provider in North America, Pure Wafer delivers industry-leading quality while helping manufacturers maximize wafer life and reduce material costs.
Each wafer undergoes detailed inspection and sorting, followed by precision lapping and etching to remove surface defects. Advanced polishing and cleaning restore the wafer to a high-quality, production-ready state. A final inspection ensures full compliance with customer specifications.
Wafers are then packaged in contamination-free cassettes, double-bagged, and shipped with full yield documentation. Optional laser marking enables complete lifecycle traceability.
| Wafer Size | 100mm - 300mm |
|---|---|
| Metals | < 1E10/CM2 |
| Total Thickness Variation (TTV) | < 1 µm |
| LPD | Wafer Reclaim down to 19 nm and 26 nm Defect Counts |
| Processes | Strip, Etch, Lapping, Laser Scribe, Polish and Clean |
| Removable Films, Include | Cu, Ti, Fe, V, TiN, Cr, Ta, SiO, Ti, Zr 100% Inspection |
